Geopolitical Policy: Revised US export controls expand regulatory focus beyond raw GPU compute thresholds (FLOPs) to include memory bandwidth density, effectively restricting HBM3e memory packages exceeding 1.2 TB/s per stack.
Packaging & CoWoS Bottlenecks
The regulations target advanced multi-die packaging techniques, including TSMC CoWoS-S and Intel EMIB, where memory dies are vertically interconnected via silicon interposers.
Market Impact on SK Hynix & Micron
Memory manufacturers are realigning shipment allocations toward hyperscale AI clusters in North America and Western Europe, absorbing excess wafer supply.
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